Shenzhen GMAX Technology Co., Ltd.
Main products:BGA Rework Station,BGA Reball Kits,BGA Test-bed,BGA Placed Equipment,BGA Inspection Equipment
Products
Contact Us
  • Contact Person : Ms. Leung Daisy
  • Company Name : Shenzhen GMAX Technology Co., Ltd.
  • Tel : 86-755-27696998
  • Fax : 86-755-27696766
  • Address : Guangdong,Shenzhen,4th Floor, Building 4, Bengshan Industrial Park, Bao'an Dist
  • Country/Region : China

Lead free GM-5260 bga chips welding equipment

Lead free GM-5260 bga chips welding equipment
Product Detailed
1.bga welding equipment 2.Competitive price with high quality 3.Accuracy control 4.Imported Sensor  
1.Humanized design of Control System
2.Accurate Temperature Control System
3.Convenient visual alignment system
4.Precise mechanical parts
5.Perfect safety design
 
BGA application scope:The BGA Rework Station is suitable to welding of different BGA chips, including CCGA, BGA, QFN, CSP, LGA, Micro SMD MLF, etc., both lead and lead free   
CategoryItemsSpecifications
Temperature control systemThe Number of Heater3 independent heaters, top heater, bottom heater, IR heater
The Power of HeaterPower of top heater: 1000WPower of bottom heater: 1000WPower of IR heater: 1000W
 Heating MethodThe 1st and 2nd hot-air heaters, no requires an external source of air, the Speed of fan is controlled by software.
Temperaturecontrol algorithmHigh-precision K-type thermocouple with close-loop control, PID auto-tuning system temperature system.
Temperaturecontrol accuracy±1°C
The number of temperature curveMagnanimity
analysis oftemperature curveSupportautomatic analysis of the result of temperature curve
The number of external temperature test interfaces 4(Extensible)
Optical vision systemAlignmentOptical alignment system, driven by step motor
Accuracy±0.01mm
CameraHigh-definition CCD color optical vision system, provide the function of zoom and auto-focus
IlluminationLED background color light source, clearer BGA images
Micro-adjustmentThe X, Y axis and θ angle fine adjusted with micrometer
Size of PCB and BGASize of PCBMax 470X400mm ,Min 10X10mm
Size of BGA2X2mm—80X80mm
The scheme of clamping PCBV-groove, PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB.
The Method ofsuck BGAThe build in vacuum pump can automatically suck BGA chip
Motion controlDrive modeDriven by step motor
Control modeAutomatic adjustment of speed and position based on parameters
Control systemControl modeIndustrial PC and intelligent industrial control module
Control interface Humanized multifunctional operation interface based on Windows XP
Process controlIntelligent control of the process of welding and desoldering, automatic welding and desoldering
OthersDimensions700x600x780mm
Weight90Kg
Power supplyAC220V±10%   50/60Hz 4400WAC220V±10%   50/60Hz 4400W
 
AccessoriesQuantityRemarks
Top Nozzles4Accessories
Bottom Nozzles1 Accessories
Bracket of special-shaped PCB4Accessories
Type k thermocouple4 Accessories
Vacuum cups10Accessories
Operation manual1Accessories


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